| Customization: | Available |
|---|---|
| Customized: | Customized |
| Material: | Aluminum |
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In Stock 99.99 % High Purity Copper Cu Sputtering Target
Introduction
Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets.
| Chemical Symbol | Copper |
| Thickness | 2.3 mm OR customized size |
| Weight | 1 oz or 2 oz |
| Color | Reddish Brown |
| Application Notes |
Used for bonding with nonmetallic sputtering targets.
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