TMAXCN Brand Customized Open Cell Cu Foam Battery Electrode Copper Metal Foam

• Customization: Available
• Trademark: TMAX
• Origin: China
• Model NO.: TMAX-CuFoam6
• Production Capacity: 20000piece/Month

Product Description

The Shape Can be Customized Cylindrical Copper Metal Foam Cu Foam
Introduction
Apart from Aluminum, Copper is the most widely used material for making heat sinks, because properties of copper make it suitable for the purpose.Micro-porous copper foam is like an open cell structure, with an extraordinarily large number of interconnected pores distributed uniformly throughout the base copper material. 
Advantage:
1. Copper foam  has great function of conducting heat and electricity, which can be used as the electrode substrate of lithium ion battery or fuel cell or Nickel zinc battery and electric double layer capacitor electrode material.
2. The copper foam can be also used as Heat sink materials, heat absorption materials, chemical catalyst carrier, electromagnetic shielding materials, filtration materials, damping materials, battery electrode materials, deadening, high-grade decorative materials.
Specifications

Type	Open cell
Purity	> 99%
Form	Sheet or Roll, depending on size & thickness
Cell Size (PPI)	10-150PPI, as per request
Thickness	Standard: 1-30mm Extra thin (<1mm) / Extra thick (>30mm) can be customized as request
Size & Shape	Standard: 500*500mm/ 200*300mm; can be made in different shape as per request
Porosity	95%-98%
Open Cell Rate	≥98 %
Volume Density	>0.1g/cm3, as per request
Surface Density	200-2500 g/m ^2, as per request
Thermal Conductivity (Theoretical)	>6W/M.K
Mechanical Strength (Theoretical)	≥2.5MPa
Tensile Strength (Theoretical)	5-18MPa

Dimension (Thickness* Length*Width)

80um*200mm*300mm	0.1 to 0.2mm*200mm*300mm	0.3 to 0.5mm*200mm*300mm
1mm*200mm*300mm	2mm*200mm*300mm	3 to 5mm*200mm*300mm
6mm*200mm*300mm	8mm*200mm*300mm	10mm*200mm*300mm
20 to 35mm*200mm*300mm	35 to 55mm*200mm*300mm	The size can be customized

 

To customize various metal foams,please click the picture below for details: