| Customization: | Available |
|---|---|
| After-sales Service: | Yes |
| Warranty: | 2 Years |
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UV laser marking machine is developed by using a 355nm UV laser, it adopts third-order cavity frequency multiplication technology. Compared to infrared laser, the focusing spot of UV laser is much smaller, which helps to reduce the mechanical deformation of the materials to a large extent. It features of smaller heat affected area and more beautiful marking effect.
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Features:
1: High-precision marking, fast and controllable engraving depth.
2: Suitable for most non-metallic materials.
3: The beam quality is excellent, the photoelectric conversion efficiency is high, the performance is good, and it can be finely processed.
4: Adopt Windows interface, compatible with CORELDRAW, AUTOCAD, PHOTOSHOP, etc.
5: Support PLT, PCX, DXF, BMP and other formats, directly execute SHX, TTF fonts, support automatic codes, serial numbers, batch numbers, 2D barcode marking, and available anti-counterfeiting marking functions.
Specification Parameter
|
Common power |
3W/5W/10W/15W |
|
Laser wavelength |
355nm |
|
Frequency Range |
20-100HZ |
|
Pulse Width |
<15ns |
|
Output beam quality(M2) |
<1.5 |
|
Minimum focus spot |
0.01mm |
|
Minimum line width |
0.01mm |
|
Minimum character |
0.06mm |
|
Repeatability |
0.001mm |
|
Marking speed |
<7000mm/s |
|
Marking depth |
0.01-0.5mm(According to the material) |
|
Marking area |
110x110mm |
|
Optional marking area |
70x70mm/140x140mm/175x175mm/200x200mm/300x300mm |
|
Cooling way |
Water cooling |
|
Voltage |
110V/220V±10% |
|
Total power consumption |
700-1000W |
Samples
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